When officially announcing the M1 Ultra, Apple detailed how its most powerful custom silicon for Mac Studio is able to achieve 2.5TB/s bandwidth using its UltraFusion chip-to-chip interconnect, which involves the communication of two M1 Max SoCs working in unison. TSMC has now confirmed that Apple’s most powerful chipset to date has not been mass-produced on the giant’s 2.5D CoWoS-S (chip on wafer on substrate with silicon spacer) interposer-based package. Taiwanese, but on its integrated fan (InFO) with a local silicon interconnect (LSI) instead.

There were several ways to use a bridge to allow two M1 Max chipsets to communicate with each other, but TSMC’s InFO_LI saves costs

TSMC’s CoWoS-S packaging method is used by many of the chipmaker’s partners, including Apple, so it was speculated that the M1 Ultra would also be mass-produced using it. However, Tom’s Hardware reported that Tom Wassicka semiconductor packaging engineering professional, reposted a slide clarifying the packaging method, showing that Apple used the use of InFO_LI on this occasion.

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Even though CoWoS-S is a proven method, it is more expensive to use than InFO_LI. Cost aside, it would have been pointless for Apple to opt for CoWoS-S since the M1 Ultra only uses two M1 Max dies to communicate with each other. All other components ranging from unified RAM, GPU and such are part of the silicon chip, so unless a multi-chip design paired with faster memory like HBM was used for the M1 Ultra, InFO_LI is a better choice for Apple.

Rumor has it that the M1 Ultra will be mass-produced specifically for the Apple Silicon Mac Pro, but since it’s already used in the Mac Studio, an even more powerful solution is in the works. According to Bloomberg’s Mark Gurman, a Mac Pro is in the works and will be powered by silicon that will serve as a “successor” to the M1 Ultra. The product itself is said to be codenamed J180, with previous information implying that this successor will be mass-produced on TSMC’s next-generation 4nm process, not the current 5nm.

Unfortunately, Gurman didn’t say whether the M1 Ultra “successor” would use TSMC’s “InFO_LI” packaging method or stick to CoWoS-S, but we don’t think Apple will revert to a more expensive. Rumors claim that the new Apple Silicon will feature two M1 Ultra combined using the UltraFusion process. Although Gurman has no history of predicting the Mac Pro using a chipset formed through UltraFusion, he said earlier that the workstation will have custom silicon with up to a 40-core CPU and 128 GPU. hearts.

We should hear more about this new SoC later this year, so stay tuned.

News source: Tom’s gear


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